学术动态
当前位置: 学院首页 > 学术动态 > 正文

博士生梁锋参加国际会议回国报告公告

发布时间:2019-06-11 点击数:

汇报题目IEEE ITherm 2019 参会报告

汇报时间2019612(星期一)  15:00

汇报地点:科技园西五楼北A328会议室

汇报人:梁锋

会议名称IEEE ITherm 2019

会议时间28-31 May 2019

会议地点The Cosmopolitan of Las Vegas, Las Vegas, NV USA

会议简介ITherm 2019 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. It is sponsored by the IEEE Electronics Packaging Society (EPS). ITherm 2019 is packed with many activities, including over 180 Technical Papers in 50 sessions and 4 Technical Tracks; 3 Keynote Talks addressing the heterogeneous integration, optimization and control of electronic systems, and future technologies for servers and advanced computing; 5 Technical Panel Sessions for a highly interactive engagement with experts; 5 Technology‐Talk Sessions providing deep dive talks on high profile topics; over 80 Student Posters as a highly interactive forum on the latest research; 18 Professional Development Courses including 2 with heavy thermal content; and Vendor Exhibits and Gold/Silver Sponsor Stations. For ITherm 2019, several sessions have identified outstanding papers that will be featured in the sessions with longer presentation times. Several exciting joint ECTC/ITherm events will be held on Tuesday evening including a Student Reception, Young Professionals Networking Reception, and the EPS President’s Panel on future visions for electronic packaging. On Wednesday evening, there will be a new student additive manufacturing heat sink design competition session, as well as a joint ECTC/ITherm Women’s Panel. Furthermore, a third annual Art‐in‐Science exhibition will be held during the conference with voting throughout the week using the conference app.

 

会议交流工作

报告人:梁锋

参加论文信息

Presentation Type: Oral and Poster presentation

Title: A Central Cooling Structure for Motorized Spindles: Principle and Application.

Author: Feng Liang, Jianmin Gao, Fajing Li, Liang Xu, Zhao Wang, Hongquan Jiang

Abstract: A central cooling structure for a grinding motorized spindle (150SD) is proposed under the inspiration of principle of miniature revolving heat pipes (MRVHPs). Firstly, a single MRVHP is experimentally investigated at different heat loads (2.5~30 W) and rotational speeds (1000~3000 rpm). An empirical correlation between the Nusselt number of MRVHP and rotational Reynolds number is obtained on the basis of the experimental data. And then, a transient thermal simulation of motorized spindle is conducted on ANSYS Workbench, based on the experimental data of MRVHP and the thermal boundary conditions of the motorized spindle. The results show that the introduction of the central cooling structure can reduce highest temperature of 150SD by 35%.

地址:陕西省西安市咸宁西路28号 邮编:710049
           版权所有:西安交通大学机械学院 站点维护: 数据与信息中心 陕ICP备06008037号