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硕士生金东参加国际会议回国报告

发布时间:2019-07-16 点击数:


汇报题目: ICSV26-- (The 26th International Congress on Sound and Vibration) 参会报告

汇报时间:2019年7月17日 19:00

汇报地点:模具所二楼会议室

汇报人:金东


会议名称:The 26th International Congress on Sound and Vibration

会议时间:7-11 July 2019


会议地点:Montréal, Canada

会议简介: This congress is a leading event in the area of acoustics and vibration and provides an important opportunity for scientists and engineers to share their latest research results and exchange ideas on theories, technologies and applications in these fields. The congress will feature a broad range of high-level technical papers from across the world: distinguished plenary lectures will present recent developments in important topics of sound and vibration and include discussions about future trends.


参加论文信息

Title:RESEARCH ON LOW STRESS FATIGUE CROPPING PROCESS PARAMETERS BASED ON ACOUSTIC EMISSION TECHNOLOGY

Author:Jingxiang Li, Dong Jin, Shengdun Zhao, Yi Hua, Jingzhou Gao, Wei Du and Bingkun Liu



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